TSMC considering advanced chip packaging capacity in Japan, sources say – ET Auto
Baua Electric
MARCH 17, 2024
Taiwan’s TSMC is looking at building advanced packaging capacity in Japan, according to two sources familiar with the matter, a move that would add momentum to Japan’s efforts to reboot its semiconductor industry. Currently, all of TSMC’s CoWoS capacity is in Taiwan. TSMC Chief Executive C.C.
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