TSMC considering advanced chip packaging capacity in Japan, sources say – ET Auto
Baua Electric
MARCH 17, 2024
TSMC is partnering with companies including Sony and Toyota with total investment in the Japan venture expected to run to more than USD 20 billion. One option the chipmaking giant is considering is bringing its chip on wafer on substrate (CoWoS) packaging technology to Japan, according to one of the sources who was briefed on the matter.
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